ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,742, issued on April 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Layout design method and stru... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,742, issued on April 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Layout design method and stru... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,743, issued on April 14, was assigned to LPKF LASER & ELECTRONICS AG (Garbsen, Germany). "Method for making a recess or opening into a pla... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,743, issued on April 14, was assigned to LPKF LASER & ELECTRONICS AG (Garbsen, Germany). "Method for making a recess or opening into a pla... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,744, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Integration of glass core into electronic substrates for fine... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,744, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Integration of glass core into electronic substrates for fine... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,745, issued on April 14, was assigned to FORMITEK ELECTRIC (ZHOUSHAN) Co. LTD. (Zhoushan City, China). "Switching power device and paralle... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,745, issued on April 14, was assigned to FORMITEK ELECTRIC (ZHOUSHAN) Co. LTD. (Zhoushan City, China). "Switching power device and paralle... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,746, issued on April 14, was assigned to Renesas Electronics Corp. (Tokyo). "Method of manufacturing semiconductor device" was invented by... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,746, issued on April 14, was assigned to Renesas Electronics Corp. (Tokyo). "Method of manufacturing semiconductor device" was invented by... Read More